Copper CAS NO.7440-50-8

Diamond Powder Specially Used for Diamond Wire SCMD-WD Characteristics: Selecting MBD high intensity diamond powder as the raw materials, good shape…

Diamond Powder Specially Used for Diamond Wire SCMD-WD Characteristics: Selecting MBD high intensity diamond powder as the raw materials, good shape, narrow distribution, high intensity, abrasion-resistance and purity, good dispersion and wear resistance. Application field: grinding and polishing of organic and inorganic brittle materials, such as wire saw, gem and semiconductor blade. Processing polysilicon, gem, sapphire, quartz, optical instruments, LED sapphire substrates, LCD glass, etc. Available Sizes: 7-10/50-60